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| Position wanted: |
Engineering position |
| Job category: |
AdministrativeComputerConstructionElectronicsEngineeringIndustrialInformation TechnologyManufacturingProductionTelecommunications |
| Preferred Location: |
UAE United Arab Emirates |
| Preferred City-State/County: |
Dubai |
| Objective and Resume Summary: |
|
To secure a career that will further enhance and develop my knowledge and ability in the field of electronics and communications and to improve my interpersonal skills. Be able to contribute my experiences and passion, which will help strive the growth of the company.
|
| Skills: |
Engineer / Telecommunications Engineer / Process Engineer / Document Controller Engineer / QA/QC Engineer / R and D Engineer
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| Known languages (and levels): |
English-Very Good
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| Type of Employment wanted: |
Full Time
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| Minimum Yearly Salary in Numbers: |
Unspecified
|
| Current Location: |
UAE United Arab Emirates, Dubai |
| Education History, Qualifications & other additional information: |
| Level of Education: |
Bachelor
|
Educational Background:
Elementary: San Antonio Bagong Buhay
San Antonio, Cabiao Nueva Ecija
Date Graduated: March 29, 1995
Secondary: Cabiao National High School
Cabiao Nueva Ecija
Date Graduated: April 02, 1999
Tertiary: Bulacan State University
Date Graduated: April 04, 2004
Bachelor of Science in Electronics and Communications Engineering
Board Exam: Electronics and Communications Licensure Examination on November 20-21, 2004 (Results)
ECE Board Passer with License No. 0033534
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| Work History & Experience: |
| Years of Work Experience: |
3 to 5 Years |
End-Of-Line Flip Chip Process Engineer (Amkor Technology Philippines from Feb 2005 to August 2008)
Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the entire die surface to be used for electrical connections to the substrate, exponentially increasing the I/O per unit area vs. perimeter interconnect technologies. Implementing process technology licensed from industry leader LSI Logic, Amkors FC package uses solder bump flip chip interconnect, and can route over 1000 signal traces from a single die out to a 1.0 mm pitch BGA footprint.
Responsible in providing technical support and guidance on process implementation and analysis to ensure conformance of the assembly process to set specifications.
Ensures attainment of the stations optimum yield capacity, as well as high product quality and reliability.
Ensures proper implementation of established manufacturing processes.
Identifies, modifies, and upgrades processes and controls in order to meet set quality, yield and turnaround time at optimum cost.
Drives/generates programs geared toward improvement in cost, productivity and quality for manufacturing needs.
Attends to all customer issues, provides data analysis and their corrective and preventive measures. Troubleshoots problems in manufacturing lines and responds to customer complaints on technical matters.
Generates and reviews process documents such as specifications and work standard guides to be used and implemented in production.
Ensures adherence to customer standards and recommends actions like stopping production and hold shipment if necessary to contain and correct quality problems.
Ensure adherence to quality systems standards and procedures, such as FMEA, SPC, QC tools, OCAP, MSA, and PSM.
Ensures quality of work to the satisfaction of customers (internal or external).
Review and qualify direct and indirect materials for package robustness and cost reduction.
Completes assigned special projects or programs to attain plant targets such as yield goals.
Analyze, evaluate and implement improvement programs for yield, cycle time, cost and manufacturing processes.
R and D Engineer-Dual Function (Amkor Technology Philippines from Feb 2005 to August 2008)
Provide new product development and tested for future production
Modified existing procedures that will lessen the work and new methodologies
Provide methodologies, detailed estimates and cost effective new products
Inquires quotation for new materials for product development and testing
Detailing of the new product line from start to finish
Meeting the requirements of the client prior to aesthetical and structural consideration
Weekly and monthly report monitoring
Maintain complete documentation prior for internal and external audit
Suppliers testing of new products
Invites client for mock up of new product line
Creates new forms for ISO Procedures prior for documentation
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Resumes:68165 |
Employers:8083 |
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