Failure Analysis Engineer, Microelectronics; Starlink

Bastrop, TX

Space

X was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today Space

X is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

Starlink is Space

X’s ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. We are developing millions of devices for end users to link our customers to our satellites.

As a Failure Analysis Engineer on the Starlink team, you will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns. You will leverage advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions that improve the reliability of our satellite constellation and user terminals.

• Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
• Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
• Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
• Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
• Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
• Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
• Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials

• Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline
• 2+ years of hands‑on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)

• Master’s or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
• Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
• Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
• Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
• Hands‑on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
• Experience applying JEDEC and AEC reliability test standards and physics‑of‑failure methodologies to root cause investigations
• Experience analyzing complex datasets with Python, JMP, or similar tools
• Excellent problem‑solving, communication, and technical writing skills

• Ability to work overtime and weekends as needed
• Ability to work in a cleanroom or ESD‑controlled environment when required
• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about ITAR here.

Space

X is an Equal Opportunity Employer; employment with Space

X is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of Space

X’s affirmative action plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to