IC Package Engineer; Starlink​/Akoustis

Position: IC Package Engineer (Starlink/Akoustis)
Space

X was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today Space

X is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

IC PACKAGE ENGINEER (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of Space

X, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. The root of Space

X's success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game-changer and levels the playing field for those who were previously unconnected.

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. In this role, you'll play a critical part in enabling high-reliability, high-performance electronics for cutting-edge applications. You will work cross-functionally with design, manufacturing, reliability, supply chain, and failure analysis teams to deliver optimized semiconductor packaging that meets stringent thermal, mechanical, and electrical requirements.

The ideal candidate will bring hands-on experience in semiconductor packaging, materials science, and electronics manufacturing processes, with a passion for technical innovation and attention to detail.

RESPONSIBILITIES:

* Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA

* Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties

* Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques

* Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs

* Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus

* Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production

* Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation

* Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions

* Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies

* Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration

* Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders

BASIC QUALIFICATIONS:

* Bachelor's degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or or other engineering discipline

* 1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)

PREFERRED QUALIFICATIONS:

* 2+ years of hands-on experience with semiconductor packaging technologies, including:

* Flip-chip, wire bond, WLP, LGA, CSP, QFN

* Organic/inorganic substrates and PCB manufacturing

* Deep understanding of packaging materials and their thermal, mechanical, and electrical properties

* Familiarity with thermal management techniques for power-dense or mission-critical electronics

* Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)

* Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc.

* Strong analytical skills with expertise in:

* Root Cause Analysis

* Statistical Process Control (SPC)

* Six Sigma / Lean tools

* Failure Mode and Effects Analysis (FMEA)

* Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)

* Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain

* Strong project management, organizational, and communication skills

ADDITIONAL REQUIREMENTS:

* Must be willing to work extended hours and weekends as needed to meet critical milestones

* Ability to travel up to 20% domestically and internationally for supplier and manufacturing support

* Ability to perform light physical tasks (lifting up to 25 lbs, handling packaging samples)

ITAR REQUIREMENTS:

* To conform to U.S.…