Senior Product Engineer, Advanced Packaging & HBM
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-04-29
Listing for:
Micron Technology, Inc.
Full Time
position Listed on 2026-04-29
Job specializations:
-
Engineering
Packaging Engineer, Product Engineer, Electronics Engineer
Job Description & How to Apply Below
Micron Technology, Inc. is seeking a skilled Product Engineer to lead a team in the development of advanced packaging solutions. You will collaborate with various engineering teams and manage a portfolio of next-generation HBM products. Ideal candidates have a Ph.D. in relevant fields and over 10 years of experience in the semiconductor industry, with a deep understanding of packaging processes.
Micron offers a competitive benefits package and values diversity in the workplace.
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Position Requirements
10+ Years
work experience
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