Senior Wire Bonding Manufacturing​/Process Development Engineer

Position: Senior Wire Bonding Manufacturing / Process Development Engineer
** Be visionary*
* Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

** Job Description*
* ** Position Summary*
* The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing. This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements. The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.

** Must be US Citizen or PERM Resident*
* ** Key Responsibilities*
* ** Process Development & Optimization*
* + Develop, refine, and sustain automated wire bonding processes (ball bonding, wedge bonding, ribbon bonding, and related technologies).

+ Establish and optimize bonding parameters, material selections, and tooling configurations for new and existing products.

+ Lead DOE (Design of Experiments) and statistical analysis to improve yield, reduce variation, and enhance process robustness.

+ Define process controls, monitor KPIs, and ensure compliance with industry standards (e.g., MIL‑STD‑883, IPC‑A‑610, J-STD‑001).

** Production Support*
* + Provide daily engineering support to manufacturing related to wire bond equipment, tooling, and process troubleshooting.

+ Partner with operations and technicians to resolve production issues, material defects, and equipment performance problems.

+ Implement root cause and corrective actions (RCCA), including 5‑Why, fishbone analysis, and FMEA updates.

+ Support production ramp, maintaining stable throughput while minimizing scrap and rework.

** Equipment & Tooling*
* + Serve as equipment owner for automated wire bonders (e.g., Palomar, Hesse, Kulicke & Soffa, or equivalent).

+ Develop and maintain PM procedures, calibration requirements, and equipment qualification documentation.

+ Identify and implement upgrades, automation improvements, and fixturing enhancements to improve reliability and operator safety.

** Documentation & Compliance*
* + Create and maintain technical documentation: work instructions, process specifications, PFMEA, control plans, and training materials.

+ Ensure compliant handling of sensitive information and adherence to company, customer, and government requirements.

+ Support internal and external audits through documentation, data, and process demonstrations.

** Continuous Improvement*
* + Lead yield improvement projects and cycle‑time reduction initiatives.

+ Drive process automation and digitalization efforts aligned with factory modernization goals.

+ Support lean manufacturing activities including 5S, standard work development, and waste reduction.

** Qualifications*
* + Bachelor's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Manufacturing Engineering, or related field preferred.

+ 3+ years of relevant experience in microelectronics manufacturing, preferably with automated wire bonding.

+ Strong hands-on experience with automated wire bonders and related process inputs (ultrasonic energy, force, time, loop profiles, etc.).

+ Proficiency with SPC, DOE, statistical analysis, and data‑driven decision making.

+ Demonstrated ability to troubleshoot both equipment and process-level issues.

+ Ability to read technical drawings, schematics, and material specifications.

** Preferred Qualifications*
* + Experience in an aerospace, defense, semiconductor, or high-reliability manufacturing environment.

+ Familiarity with MIL‑STD‑883, NASA workmanship standards, and high-reliability bonding requirements.

+ Knowledge of…