Senior Technologist, Hybrid Bonding Module

## Senior Technologist, Hybrid Bonding Module Apply locations:
US, Oregon, Hillsborotime type:
Full time posted on:
Posted Todayjob requisition :
JR0284467#
** Job Details:**##

Job Description:

** The Role and Impact
** As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.

You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.

Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
** Key Responsibilities
*** Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
* Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
* Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
* Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
* Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
* Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
* Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
* Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
* Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
* Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
** Behavioral Skills
*** Demonstrated ability to solve complex technical problems using structured engineering methodologies.
* Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
* Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
* Proven ability to mentor and develop engineers and technical team members.
* Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.##
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* Qualifications:

**** Minimum Qualifications
*** Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR
* Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of experience; OR
* PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 4+ years of experience.
* 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.
** Preferred Qualifications
*** Experience leading first-of-a-kind (FOK) process or equipment development programs.
* Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
* Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
* Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
* Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
* Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
* Experience collaborating…