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Product Development Engineer

Job in Lehi, Utah County, Utah, 84043, USA
Listing for: ORYXsearch
Full Time position
Listed on 2026-06-01
Job specializations:
  • Engineering
    Electrical Engineering, Systems Engineer
Job Description & How to Apply Below
Position: 7096 - Product Development Engineer
Product Development Engineer (28nm CMOS)

Confidential - Leading Semiconductor Manufacturer

Why This Role

This is a rare opportunity to work at the core of 28nm CMOS technology development, where device physics meets real-world production. You'll take ownership of process integration, drive yield improvements, and help transition advanced nodes into high-volume manufacturing.

If you enjoy solving complex problems at the transistor and process level-and want your work to directly impact production-this role delivers.

What You'll Do

Process Integration & Device Optimization
  • Develop and refine 28nm CMOS process flows across FEOL/BEOL
  • Optimize transistor performance, variability, and reliability
  • Work closely with device, design, and fab teams to align performance targets
Yield & Performance Engineering
  • Analyze electrical test data, inline metrics, and defectivity trends
  • Drive yield improvement through root cause analysis and corrective actions
  • Correlate parametric data to process variations and device behavior
Technology Transfer & Manufacturing Ramp
  • Support transition from development to high-volume manufacturing (HVM)
  • Define process windows, control plans, and production specs
  • Partner with manufacturing teams to ensure stable, repeatable output
Cross-Functional Collaboration
  • Interface with design, modeling, and reliability teams
  • Contribute to DTCO/STCO efforts for performance and scaling
  • Support failure analysis and long-term reliability improvements
What You Bring
  • BS/MS/PhD in Electrical Engineering, Materials Science, Physics, or related field
  • ~5-12 years of experience in semiconductor process development or integration
  • Strong background in:
  • CMOS technology (≤28nm preferred)
  • Process integration (FEOL, HKMG, silicidation, or BEOL)
  • Device physics and electrical characterization
  • Experience with:
  • Yield analysis, DOE, SPC, and failure analysis
  • TCAD or electrical simulation tools (a plus)
  • Ability to work cross-functionally in a fast-paced fab environment
What Makes This Role Different
  • End-to-end ownership - from process development to production ramp
  • High visibility - direct impact on yield, performance, and business outcomes
  • Advanced node exposure - meaningful work at 28nm and beyond
  • Technical depth - real device-level problem solving, not just incremental optimization
Ideal Backgrounds
  • Process Integration Engineer (CMOS / Logic)
  • Device Engineer with strong fab interaction
  • Yield / Product Engineer with deep process understanding
  • Engineers from leading IDMs or foundries working on sub-40nm nodes
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