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Sr. Integration Engineer

Job in Milpitas, Santa Clara County, California, 95035, USA
Listing for: Headway Technologies Inc
Full Time position
Listed on 2026-06-08
Job specializations:
  • Engineering
    Manufacturing Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 127967 - 188187 USD Yearly USD 127967.00 188187.00 YEAR
Job Description & How to Apply Below
TITLE:

SR. MANUFACTURING INTEGRATION ENGINEERFLSA STATUS: EXEMPT

REPORTS TO:

MANAGER, PLATING MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Manager of Plating Manufacturing Engineering, the Sr. Manufacturing Integration Engineer is responsible for monitoring, sustaining, and providing support for the manufacturing process, including detecting and correcting process errors, releasing and integrating new programs into the manufacturing line, providing guidance and support to engineers regarding experiments or evaluations, and providing feedback to the backend process group. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

Engages in process improvement activities based on Wafer Design Change Notifications (WDCN) and Wafer Process Change Notifications (WPCN), including following up with CCN documentation for line conversion activity

Examines newly transferred products to ensure leading wafer follows wafer configuration specifications

Evaluates sample wafers, conducts experiments, and reviews results in support of yield improvement activities; issues Lot Configuration Changes (LCC) and CCN’s as needed

Interprets analytical defect data from imaging equipment such as FIB, SEM, EDX, and TEMMonitors and supports manufacturing process controls to alert for abnormal wafers; recommends corrective action if needed

Responds to inquiries from other team members, managers, or departments

Uses Statistical Process Control (SPC) and other complex software applications to analyze large volumes of data; develops charts or reports and presents findings before groups or teams

Adheres to all safety policies and procedures as required

Performs other duties of a similar nature or level

* MINIMUM QUALIFICATIONS:

Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience;
Master’s degree preferred

Five years of hands-on experience working in either the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role Strong analytical and critical thinking skills

Hands on experience in SPC and Design of Experiments (DOE)
Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities:

Knowledge of magnetic recording head or HDD manufacturing

Knowledge and ability to understand various defect image results from FIB, SEM, EDX, and TEM tools

Knowledge and technical understanding of circuit design and testing

Knowledge and experience using JMP or Excel and the ability to create macro formulas

Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations

Able to design complex experiments, analyze results, and recommend corrective action

Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management

Able to work productively and collaboratively with all levels of employees and management

Able to comply with all safety policies and procedures

Able to use critical thinking to resolve issues, examine trends, conduct root cause analysis, and make recommendations for process improvements

Demonstrated analytical skills

Demonstrated organizational and time management skills

Demonstrated problem-solving and trouble shooting skills

Flexible and able to prioritize

The annual base salary for this full-time position is between $-$ + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Sr. Manufacturing Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions,…
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