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Hardware Engineer - Experienced; PCB, Circuit Design, Industrialization, Wireless, ECAD Reloca

Job in City of Rochester, Rochester, Monroe County, New York, 14602, USA
Listing for: GE Vernova
Full Time position
Listed on 2026-05-04
Job specializations:
  • Engineering
    Electrical Engineering, Systems Engineer, Electronics Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Position: Hardware Engineer - Experienced (PCB, Circuit Design, Industrialization, Wireless, ECAD) Reloca[...]
Location: City of Rochester

Job Description Summary

Sign On Bonus and Relocation Assistance.

As a Hardware Engineer for Critical Infrastructure Communications (CIC) at GE Grid Solutions, you will design industry-leading solutions for industrial-grade wired and wireless communications products. The CIC team seeks an experienced Electrical Engineer who is team-oriented, thrives in the critical path, and has a demonstrated track record of bringing a broad range of products from concept to production. The successful candidate will have practical circuit-level design and troubleshooting experience in a laboratory environment and will work across the product lifecycle, including production, with colleagues in an international engineering organization.

Strong written and verbal communication skills are required to convey complex solutions to audiences of varying technical expertise on a cross-functional team spanning multiple sites.

Job Description

Roles and Responsibilities:

  • Contribute to the hardware development of industrial-grade communications equipment by applying principles and techniques of electrical engineering, circuit design, and analysis.
  • Complete the analysis and design of digital and mixed-signal communications circuitry including MCU, CPU, flash, Ethernet, and USB considering EMC, thermal, mechanical, and electrical safety constraints.
  • Complete schematic and PCB layouts containing digital, analog, and RF circuitry.
  • Create new components and maintain component database.
  • Create production documentation including top level bills of material and label specifications.
  • Perform sustaining engineering activities for legacy products by mitigating component shortages through qualifying alternatives or redesigning circuits and sub-assemblies to address obsolescence.
  • Distill product requirements into technical requirements, estimate scope of work, and develop hardware concept designs as required to meet project deadlines.
  • Work onsite with a team of Electrical and Embedded Firmware Engineers in an office/lab environment.
  • Perform and document the results of circuit-level validation testing.
  • Ensure compliance to product safety, emissions, and performance standards supporting third-party certification labs as needed.
  • Support and troubleshoot existing product design deficiencies reported by customers and manufacturing.
  • Perform MTBF and reliability data for the individual product subsystems.
  • Provide support and specifications to Manufacturing and Test Engineering teams.
Required Qualifications:
  • Bachelor’s degree in Engineering.
  • Minimum 5 years of prior hardware design experience and product development (ideally in telecommunication products).
Desired Characteristics:
  • Familiarity with emissions standards including FCC, IC, ETSI, Anatel, or ACMA.
  • Experience with communication interfaces and protocols (e.g., Ethernet, USB, I2C, SPI).
  • Familiarity with safety standards including EN62368-1 and EN60950-1.
  • Proven knowledge of EMC and environmental standards required for CE Mark certification of telecommunication products.
  • Ability to multi-task, prioritize tasks, and quickly adapt in a fast-paced engineering environment.
  • Experience with Altium Designer.
  • Ability to solder/desolder surface mount and through-hole components.
  • Experience using signal generators, network analyzers, and spectrum analyzers.
  • Ability to work collaboratively with an international development team.
  • Familiarity with MCU, SoC, and modem integration for 4G LTE, 5G, and WiFi technologies.
  • Demonstrated ability to work autonomously and with a team to resolve technical issues.
  • Demonstrated ability to produce Hardware Design Specifications and other relevant design documentation.
  • Strong interpersonal and leadership skills.
Additional Information

The base pay range for this position is 98,400.. The specific pay offered may be influenced by factors including experience, education, and skill set. This position is eligible for a 10% Variable Incentive Bonus. The posting may close on a future date. Geographically related pay differentials may apply in certain areas. Health, retirement, and other benefits are provided as part of GE Vernova’s benefits program.

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