Silicon Photonics & Optical Packaging Engineer

** Role Number:*
* ** Summary*
* Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team.

In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.

** Description*
* Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.

Minimum 5% International travel.

** Minimum Qualifications*
* + BS and a minimum of 20 years relevant industry experience

** Preferred Qualifications*
* + M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.

+ Excellent teamwork and communication skills.

+ Strong theoretical background in optics and photonics fundamentals, device/module integration.

+ Hands-on experience in packaging and measuring fiber-coupled devices.

+ Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.

+ Min. 5 years works experiences in the related field with M.S and or Ph.D.

+ Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, ...)

+

Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.