Process Engineer – Advanced Semiconductor Packaging

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world‑class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in more than 100 countries.

Keysight’s HFTC, located in Sonoma County, Santa Rosa, California, is a world‑class semiconductor organization that invents, designs, and manufactures state‑of‑the‑art custom integrated circuits (ICs) to enable industry‑leading test and measurement solutions. HFTC’s proprietary indium phosphide (InP) and gallium arsenide (GaAs) platforms make possible some of the world’s highest‑speed and highest‑frequency Monolithic Microwave Integrated Circuits (MMICs). The 50,000‑sq‑foot micro‑fabrication facility and deep expertise in IC design and advanced compound semiconductor manufacturing provide a distinct competitive advantage in performance.

We focus on process research and development, process integration, and new product introduction. You will lead the development of next‑generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.

• Develop and maintain wafer fabrication processes
• Develop and maintain package assembly processes
• Specify, select and qualify new equipment
• Contribute to process automation
• Review new designs for manufacturability and provide feedback to module designers
• Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
• Meet accelerated project schedules; communicate and manage risks
• Develop and maintain high yields while adhering to project schedules

BS, MS, or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields with 2–5+ years of applicable experience in semiconductor fabrication/advanced packaging processes.

We are seeking an industry professional with proven expertise in three or more of the following areas:

• Design for manufacturing of electromechanical assemblies
• Statistical process control (SPC), design of experiments (DOE)
• Thermocompression / flip‑chip bonding
• Surface Mount Technology (SMT) processes
• Die singulation
• Semiconductor fabrication processes
• Heterogeneous integration, advanced packaging techniques
• New technology introduction
• New product introduction

• III‑V compound semiconductors and/or silicon technologies
• Thermal, mechanical and electrical reliability
• Technical project management, project lifecycle

Candidates must be local or willing to relocate to Santa Rosa, CA. This role requires access to export‑controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or a protected individual with authorization from the U.S. government for export‑controlled items under 8 U.S.C. 1324b(a)(3).

Santa Rosa, CA: $126,930 – $169,240 – $211,550

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units