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RF Packaging Process Engineer - Die Attach & Wire Bonding
Job in
Sedgefield, Stockton-on-Tees, Durham County, TS19, England, UK
Listed on 2026-06-01
Listing for:
Filtronic Plc
Full Time
position Listed on 2026-06-01
Job specializations:
-
Engineering
Manufacturing Engineer, Process Engineer
Job Description & How to Apply Below
Filtronic Plc seeks a Process Engineer to enhance its production processes at their Sedgefield facility. The role involves developing and optimizing semiconductor assembly processes, particularly die attach methods and gold wire bonding. Candidates should possess a degree in Engineering or related fields, have experience in assembly processes, and demonstrate strong analytical and problem-solving skills. Filtronic is committed to diversity and encourages applications from all qualified candidates.
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