Senior Failure Analysis Engineer; Semiconductor/Electronics
Listed on 2026-06-02
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Engineering
Electronics Engineer, Electrical Engineering, Quality Engineering, Materials Engineer
- Full-time
- Compensation: USD 100,000 - USD 160,000 - yearly
Eurofins EAG Laboratories has over 40 years experience in engineering and materials testing services. Our parent company, Eurofins Scientific, is a multi-billion-dollar global leader in engineering and scientific services operating over 950 labs in 60 countries with 65,000 employees with a portfolio of over 200,000 validated analytical methods.
At EAG, curiosity fuels everything we do. Every analysis, every test, and every question asked in our labs helps unlock what materials and products are capable of—and what the world can build next. If you’re energized by materials science, analytical chemistry, engineering rigor, and solving problems that matter, you’ll feel right at home here.
Our scientists and engineers support industries ranging from semiconductors and advanced electronics to pharmaceuticals, medical devices, energy systems, and consumer products. Using advanced techniques in analytical chemistry, microscopy, surface analysis, and engineering sciences, we help clients solve complex challenges across the product lifecycle.
What sets EAG apart isn’t just our world‑class instrumentation—it’s our people. We’re problem solvers, collaborators, and lifelong learners who value precision, curiosity, and impact. Here, your work directly influences the safety, reliability, and performance of products used around the globe.
Imagine the possibilities. Let’s explore them together.
Job DescriptionLocation: Sunnyvale, CA (Onsite)
Schedule: Full-time, onsite lab role. Typical Monday–Friday daytime hours; flexibility required to support urgent analyses, extended hours, or occasional weekend work based on lab demand.
About the Role
Eurofins EAG Laboratories is seeking a Senior Failure Analysis Engineer to lead hands‑on investigations of electronic components, packages, and systems. You will work directly in the lab owning failure analysis from problem definition through root cause and client recommendations.
This role is best suited for someone who enjoys deep technical debugging, operates lab tools independently, and can translate complex data into clear, actionable conclusions.
What You’ll Do
- Perform hands‑on failure analysis on semiconductor devices and electronic components (ICs, subcomponents, systems)
- Design and execute analytical plans to determine root cause of electrical/mechanical failures
- Use and interpret results from tools such as: X‑ray, SEM/EDS, FA isolation techniques, and electrical characterization tools
- Analyze ATE datalogs, schematics, and test results to diagnose issues
- Lead or contribute to fault isolation and deprocessing workflows
- Review, validate, and approve lab data and technical reports
- Communicate findings to internal teams and external clients in clear, practical terms
- Identify process improvements to increase lab throughput and reduce repeat failures
- Support cross‑functional collaboration with lab staff to manage workflow, quality, and priorities
Why Join EAG
- Work on high‑impact technical problems across multiple industries
- Access to advanced lab tools and techniques
- Opportunity to own investigations end‑to‑end and influence outcomes
- Collaborative, hands‑on team environment focused on technical excellence
Compliance Requirement (ITAR)
This position supports work subject to U.S. export control regulations.
Applicants must meet U.S. Person status as defined by ITAR:
- U.S. Permanent Resident (Green Card)
- Protected Individual (asylee or refugee)
- Bachelor’s or Master’s degree in Electrical Engineering or related field
- 8+ years of hands‑on failure analysis experience in semiconductor or electronics environment
- Demonstrated experience with multiple FA techniques and tools, such as:
- Electrical characterization (curve trace, parametric analysis, oscilloscope)
- Fault isolation (e.g., OBIRCH, emission microscopy, thermal techniques)
- Deprocessing and sample prep (e.g., RIE, FIB/PFIB, lapping, etching)
- Physical analysis (SEM/EDS, cross‑sectioning, X‑ray, C‑SAM)
- Working knowledge of device physics, IC layout, and semiconductor processes
- Experience reviewing and writing technical reports for internal or customer use
- Ability to work…
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