Intern, Product Engineer

Requisition
28966
-Posted
- Engineering

- Internship/Co-op

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market.

The company’s comprehensive portfolio includes advanced packaging, wafer‑level processing, and system‑in‑package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit  .

Amkor Technology is seeking a qualified student to intern for the Advanced Flip Chip product team based at the corporate offices in Tempe, AZ. The Intern will work closely with various product engineers and other interns supporting projects throughout the year. We are looking for a candidate with a strong analytical capability and well‑developed problem‑solving skills, with the ability to effectively communicate findings and recommendations.

• Learn about and support Customer, Product and Marketing strategies within the semiconductor packaging field.
• Collect, analyze and understand product analytics to integrate into a strategy to win in target markets.
• Assist in the automation process to analyze the pricing strategy across customers in the Business Units (BU) based on various package design attributes.
• Work on projects that will support pricing analysis, volume allocation and effective utilization of factory equipment.
• At the end of the internship, Intern will deliver a summary of the project, including recommendation of future steps.

• Student applicants must be currently enrolled in a four‑year accredited college or university pursuing a Bachelor's Degree in Engineering.
• Candidate must have completed at least their Junior year prior to the start of the internship.
• Strong verbal and written communication skills.
• High aptitude to learn new concepts while performing tasks with attention to details.
• Motivated, self‑starter and ability to manage multiple tasks.
• A dynamic 'can do' personality with excellent relationship building skills, and result‑oriented approach.
• Must be available to begin the internship in May 2026and for a minimum of one (1) year;
  Amkor internships offer flexible part‑time schedules during the semester requiring full‑time availability during the summer.

• Possessing knowledge and interests in the semiconductor packaging industry is preferred.
• A minimum 3.0 GPA (based on a 4.0 scale) is preferred.
• Proficiency with Microsoft Office tools (PowerPoint, Excel, Project, Word, etc.).
• Experience in Excel formulas, graphing, pivot table, VBA and data management will be a plus.
• Ability to perform hands‑on research and analysis using data mining tools.

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office. No housing or relocation will be provided.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.