Physical Design; Lead
08001, Barcelona, Cataluna, España
Publicado en 2026-07-07
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Ingeniería
Ingeniero de sistemas, Ingeniero de Hardware, Ingeniero Electrónico, Ingeniero eléctrico
Job Description
Our client is expanding their Physical Design organization and is looking for an experienced Physical Design Lead to drive end to end physical implementation of complex SoC or SiP programs.
In this role, you will take ownership of the full physical implementation flow, from floor planning and implementation through tape out, production and post silicon validation. You will work closely with IP providers, EDA vendors and silicon or package partners to ensure high performance and reliable chip delivery at advanced technology nodes.
Location
:
Barcelona, Spain - Hybrid
As a Physical Design Lead
, your broad responsibilities will include but are not limited to:
Lead the full physical implementation process of complex SoCs using advanced technology nodes
Drive coordination between chip design, package design and PCB teams to ensure alignment
Collaborate with external IP providers, EDA vendors and silicon or package vendors
Ensure compliance with product goals, timelines and quality targets through structured planning and reporting
Provide technical guidance on physical design flow, design for test and EDA methodologies
Moderate design reviews and technical discussions to enable efficient decision making
Support reliability, yield optimization and production readiness
Perform hands on technical tasks when required to support the team
Master or PhD degree in Computer Science, Microelectronics, Physics or related field
Proven experience with multiple tape outs of high performance SoCs or SiPs for mass production
Strong background in advanced physical implementation flows and high speed digital design
Demonstrated experience managing complex SoC or SiP programs as a functional lead
Experience working with external IP, EDA and silicon or package vendors
Excellent presentation, coordination and conflict management skills
Strong understanding of reliability and yield optimization
English level C1 or higher
Experience with multi chiplet design
Exposure to advanced packaging technologies
Background in post silicon validation and production ramp up
Our client offers an exciting, challenging role in a collaborative, dynamic environment. The right person will find many career growth opportunities in their company, whether you want to advance your technical skills or aspire to leadership in the future.
Benefits:Flexible working hours ( You can work between 7 AM and 7 PM )
Hybrid model, one day remote per week
One week per year work from anywhere
25 days annual leave plus additional December 24 and 31
Private medical insurance
Relocation package including flight, visa support + first month accommodation
Relocation support for family
Virtual shares
Spanish language classes
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