Photonics Packaging Engineer

My client is looking for a Photonics Packaging Engineer to support packaging development for Photonic Integrated Circuits. The ideal Photonics Packaging Engineer will work across design, process and integration teams, and drive manufacturing readiness in advanced packaging for next-generation products.

• Design mechanical, thermal and optical packaging solutions for III-V photonic integrated circuits
• Develop and qualify packaging processes for fibre coupling, lens arrays and hybrid integration
• Work with suppliers to qualify production lines and improve manufacturing capability
• Perform thermal, mechanical and optical coupling simulations
• Apply design for manufacturability principles for scalable production
• Define and execute reliability and qualification plans including DOE, FMEA and accelerated tests
• Support failure analysis and continuous improvement of packaging solutions
• Collaborate with hardware, photonic and system teams for full product integration
• Maintain clear technical documentation and process records

• PhD or Master’s degree in photonics, electrical engineering, physics or a related field
• Minimum five years experience in photonic packaging, ideally III-V PICs
• Knowledge of packaging processes such as flip chip, wire bonding, fibre attach and adhesives
• Experience using CAD tools such as Solid Works
• Experience with thermal and thermo mechanical simulations
• Knowledge of optical tools such as Zemax or CodeV
• Experience with design for manufacturability and test Python programming skills

• Experience with reliability testing and standards
• PCB design experience

• Private health insurance
• Pension plan
• Flexible work hours

Benefits include private health insurance, a pension plan and flexible work hours.

If you are interested, get in touch with Ella Flynn @ IC-Resources