Trainee Program - System Engineering

Welcome to the Fraunhofer Institute for Integrated Circuits IIS!

As the largest institute within the Fraunhofer-Gesellschaft, we have been conducting research for over 30 years in diverse fields such as artificial intelligence, microelectronics, sensor systems, data acquisition, signal processing, and signal transmission. Talented individuals from various engineering and natural science disciplines will find a wide range of exciting research topics under one roof. A few highlights that reflect our innovative strength include neuromorphic computing, 5G/6G mobile communication technologies, generative AI in speech and signal processing, and X-ray imaging for e-mobility.

And that’s just the beginning!

At the Fraunhofer IIS department »Chip Design Center (CDC)«, we apply systems engineering for micro-electronics, embedded systems, medical electronics, etc.—from requirements engineering and system-level design to modular, scalable architectures. We also explore different implementation strategies like chiplets and heterogeneous integration.

• Technical Introduction: You will participate in a basic introduction to Electrical Engineering, PCB Design, Semiconductor Technology, Heterogeneous Integration and System Engineering for up to two months.
• Real Microelectronics Project Collaboration
  :
  You will collaborate on real projects in a small team under the guidance of experienced engineers for the remaining time of the Trainee Program
• Hands-On
  
  Experience:
  
  You will gain hands‑on experience in Model‑based Systems Engineering, starting from a System Idea through Requirements Engineering, System Partitioning, and Variation down to Hardware Implementation.
• Cross-Team
  
  Collaboration:
  
  You will collaborate with teams from different domains, such as Analog and Digital IC-Designers as well as Verification and Test Engineers, to experience interdisciplinary workflows and integrated product development.

• Master’s degree in electrical engineering or related fields such as medical engineering or mechatronics.
• Great technical understanding with an Engineering mindset and way of thinking.
• Fundamental knowledge in Microelectronics
  , Circuit Technology
  and Software Engineering.
• Ideally, first experience in Hardware Development (e.g. PCB-Design, CAD...) and System Design
  .
• High level of motivation and the ability to work independently
  .
• Strong team spirit and very good communication skills in English and German.

• Our Leading R&D Facility: Fraunhofer IIS is one of Europe's leading R&D IC design facilities, providing a robust platform for innovation.
• Tailored Trainee Program: We offer an individually tailored trainee program that combines academic and professional development, ensuring you gain valuable experience.
• Insight into Innovative Technologies: Our program provides insight into innovative technologies and state‑of‑the‑art design methodologies.
• Opportunities for Growth: You will have the opportunity for personal and professional growth in a dynamic setting that encourages continuous learning.
• Access to State‑of‑the‑Art Equipment: We work with state‑of‑the‑art equipment in a highly innovative research environment, allowing you benefit from a unique network of experts and partners in research and academia.
• Supportive Mentoring Program: Your goals and interests are important to us, and we regularly support you with a mentoring program to help you achieve your aspirations.

The position is initially limited to 6 months,
starting in April 2027
. The weekly working time is 39
hours
. Appointment, remuneration and social security benefits based on the public‑sector collective wage agreement (TVöD).

We value and…