Semiconductor Package Design & Application Engineer

Our Semiconductor Advanced Research team develops next-generation semiconductor, packaging, and application technologies for electric vehicle and embodied AI products. We combine system-level design, advanced packaging, simulation, testing, and failure analysis to transform early-stage concepts into validated demonstrators.

We are looking for a hands‑on, self-driven engineer with strong expertise in power or MEMS semiconductor modules, packaging technologies, and electro‑thermal‑mechanical co-design. You will work in a cross-functional and international team to develop, validate, and continuously improve advanced semiconductor-module solutions.

• Design and develop power semiconductor packages and modules, from concept definition through prototype build and validation.
• Lead or contribute to electro‑thermal‑mechanical and multiphysics co-design of semiconductor-module solutions.
• Work closely with electrical, thermal, mechanical, simulation, and process‑development experts to develop robust, manufacturable design concepts.
• Define and maintain module‑level bills of materials, including substrates, copper materials, bonding wires, encapsulation materials, thermal‑interface materials, and related packaging components.
• Create and maintain 3D component and assembly models, drawings, and technical documentation using CAD tools.
• Plan, execute, and evaluate electrical, thermal, mechanical and reliability testing of semiconductor modules.
• Support development and assembly of functional prototypes and demonstrators.
• Initiate and coordinate failure‑analysis activities with internal teams and external partners, including universities and laboratories; translate findings into design improvements.
• Evaluate emerging semiconductors, packaging, and application technologies relevant to EV and embodied AI products.
• Contribute technical input to design reviews, supplier discussions, technology roadmaps, and cross‑functional decision‑making.

• Master's degree or PhD in microelectronics, power electronics, electrical engineering, mechanical engineering, thermal engineering, materials science, or a related discipline.
• Several years of hands‑on experience in semiconductor‑package, power‑module, electronics, or electromechanical‑component design and development.
• Experience with PCB design tool such as Altium Designer or Cadence and 3D CAD tools such as CATIA or Solid Works, including development of circuit schematic, component and assembly models.
• Practical experience with semiconductor‑module testing and characterization, such as double‑pulse testing, short‑circuit testing, static characterization, thermal testing, or reliability testing.
• Basic understanding of semiconductor‑module structures, materials, interconnects, thermal paths, and packaging processes.
• Takes ownership of problems and outcomes, addressing issues transparently and constructively through root‑cause analysis and corrective action rather than deflecting responsibility.
• Comfortable working in an ambiguous and fast‑moving R&D environment; able to prioritize effectively, make sound decisions, and maintain momentum across multiple stakeholders.
• Highly self‑motivated and proactive; able to identify opportunities, risks, and gaps independently and drive work forward without requiring close supervision.
• Constructive, collaborative communicator who raises problems early, engages the right stakeholders, and focuses discussions on solutions and next steps.
• Professional fluency in written and spoken English, Chinese is a plus.

We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.

• A modern working environment in Munich.
• The opportunity to collaborate with industry‑leading experts in semiconductors, power electronics, packaging, and vehicle technology.
• Exposure to advanced semiconductor and packaging technologies with direct relevance to next‑generation EV products / power conversion / embodied AI products.
• A multicultural, entrepreneurial environment with opportunities for professional growth and international collaboration.
• Opportunities to build a professional network across Europe and China.