Senior Mechanical Design Engineer – Rugged Electronic Systems; m​/f​/d

Position: Senior Mechanical Design Engineer – Rugged Electronic Systems (m/f/d)
Role Overview

We are seeking a Senior Mechanical Design Engineer to design and deliver rugged mechanical systems for advanced embedded electronics and high-reliability platforms.

This is a hands-on product-development role covering electronic packaging, enclosure and chassis design, thermal management, structural design, ruggedization, electromechanical integration, prototyping, environmental qualification, and production release
.

The successful candidate will own mechanical designs from initial concept and architecture through detailed design, qualification, manufacturing, and production
, working closely with hardware, PCB, RF, systems, manufacturing, and other engineering disciplines.

Key Responsibilities Mechanical Design & Electronic Packaging

• Design rugged enclosures, chassis, assemblies, and mechanical structures for embedded electronic systems.
• Own mechanical development from concept and system architecture through detailed design, prototyping, qualification, and production release
  .
• Integrate PCBs, compute modules, RF modules, antennas, batteries, sensors, cameras, connectors, cable assemblies, and thermal solutions
  .
• Optimize designs for SWaP-C, structural integrity, reliability, serviceability, and harsh-environment operation
  .
• Define PCB outlines, mounting locations, keep-outs, connector positions, mechanical stack-ups, and interfaces in collaboration with hardware and PCB engineers.

CAD, GD&T & Detailed Design

• Create detailed 3D CAD models and 2D manufacturing drawings using tools such as Creo, Solid Works, or equivalent
  .
• Apply GD&T, tolerance analysis, tolerance stack-ups, fits, fasteners, and mechanical interface control
  .
• Conduct detailed design reviews and identify potential tolerance, structural, sealing, assembly, and reliability risks before release.
• Maintain accurate design documentation and configuration throughout the product lifecycle.

Thermal & Structural Engineering

• Develop passive and conduction-cooling solutions for high-performance embedded electronics.
• Design and integrate heatsinks, heat spreaders, thermal interface materials, and airflow solutions
  .
• Address thermal constraints in compact systems with limited airflow and high-power electronics
  .
• Develop mechanical solutions capable of meeting demanding shock, vibration, mounting, and structural requirements
  .
• Support thermal and structural analysis, testing, correlation, and design optimization.

Ruggedization & Environmental Qualification

• Design systems for temperature extremes, vibration, mechanical shock, humidity, dust, water ingress, corrosion, and mechanical impact
  .
• Develop IP-rated enclosures
  , sealing methods, rugged mounting solutions, and environmental protection strategies.
• Support qualification against MIL-STD-810 and relevant IP requirements
  .
• Support mechanical aspects of EMI/EMC integration
  , including considerations associated with standards such as MIL-STD-461 or equivalent
  .
• Participate in thermal, vibration, shock, ingress, and environmental testing
  , including root-cause analysis and corrective redesign following failures.

Materials & Manufacturing

• Select appropriate materials and manufacturing processes including aluminum, stainless steel, engineering plastics, elastomers, CNC machining, sheet metal, molding, and additive manufacturing
  .
• Apply DFM/DFA principles covering manufacturing, assembly, inspection, serviceability, rework, cost, and production scalability.
• Support prototype builds and manufacturing transition.
• Work directly with machining, fabrication, molding, assembly, and other manufacturing suppliers to resolve DFM, quality, cost, and production issues
  .
• Support production troubleshooting and continuous design improvement.

System Integration

• Integrate RF modules and antennas, cameras and optics, IMUs and sensors, batteries, rugged connectors, and cable assemblies
  .
• Design around strict size, weight, packaging, thermal, vibration, mounting, and center-of-gravity constraints
  .
• Collaborate closely with Hardware, PCB Layout, RF, FPGA, Software, Thermal, Systems, and Manufacturing teams
  .
• Support design reviews, prototype builds, qualification activities, failure analysis, and production-release reviews.

Experience

• 8+ years of professional mechanical design and product-development experience
  .
• Proven experience delivering rugged or high-reliability electromechanical products from concept through production.
• Experience designing compact enclosures and assemblies for embedded computing, UAVs, robotics, communications, sensor systems, aerospace, or other…