Thin Film Process Development Engineer

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron's Technology Development organization, where we develop the materials and processes that enable future generations of memory technology.

Our team solves complex thin-film, patterning, and process-integration challenges by combining materials science, semiconductor processing, experimental development, and multi-functional engineering.

As a Staff Thin Film Process Development Engineer, you will develop and own advanced thin-film deposition processes supporting next-generation semiconductor technologies. You will translate integration and device requirements into film and process solutions, establish relationships between process conditions and material behavior, and independently drive complex development problems from root-cause investigation through experimental validation. This role is ideal for an experienced process-development engineer who combines deep deposition fundamentals with hands-on semiconductor engineering and technical leadership.

• Develop, optimize, and own advanced thin-film deposition processes using CVD, PECVD, ALD, PEALD, or related deposition technologies
• Translate device, patterning, and integration requirements into measurable film properties, process specifications, and manufacturable deposition solutions
• Design and implement experiments and DOEs to identify process mechanisms, sources of variation, defectivity, and interactions between incoming materials, substrates, deposition conditions, and downstream processing
• Establish relationships between process conditions, film properties, patterning and integration behavior, electrical performance, yield, and reliability
• Drive thin-film concepts from feasibility through integration and demonstration in relevant semiconductor test structures and process flows
• Partner with patterning, etch, metrology, process integration, equipment, device, and supplier teams to solve complex cross-module engineering problems
• Evaluate new deposition technologies, materials, precursors, and process capabilities using data-driven and physics-based decision-making
• Provide technical leadership by defining development direction, communicating technical recommendations, and mentoring engineers across multidisciplinary teams

• A Bachelor's degree or equivalent experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical team, along with more than 6 years in the semiconductor industry
• Hands-on experience developing and owning semiconductor deposition techniques involving ALD, CVD, PECVD, PEALD, or similar thin-film methods
• Strong understanding of thin-film deposition fundamentals, surface/reaction mechanisms, material properties, and semiconductor process integration
• Proven ability to independently move a complex process-development problem from root-cause investigation through DOE, experimental validation, data analysis, and technical recommendation
• Experience collaborating across semiconductor process modules and technical teams to resolve process, defectivity, integration, yield, or reliability challenges

• Experience developing dielectric, hard-mask, spacer, insulating, etch-selective, or electrically functional thin films for advanced semiconductor applications
• Experience integrating new materials or deposition processes into advanced semiconductor process flows or test structures
• Hands-on experience with…