Packaging Engineer 5D/3D & Chiplet Systems
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
Steneg & Partners is seeking a Packaging Engineer to design, develop, and validate advanced semiconductor packaging solutions, including 2.5D and 3D integration, and chiplet-based architectures. You will work within multidisciplinary teams to translate innovative concepts into functional prototypes and validated demonstrators.
The role covers modelling, assembly, prototyping, testing, and collaboration with partners across the value chain to ensure robust, scalable packaging solutions for
This role, Packaging Engineer – 2.5D/3D & Chiplet Systems at Steneg & Partners, could be your next move.
This posting is for the Packaging Engineer – 2.5D/3D & Chiplet Systems role at Steneg & Partners, based in Wales, United Kingdom.
We are looking to fill the Packaging Engineer – 2.5D/3D & Chiplet Systems position at Steneg & Partners in Wales, United Kingdom.
The Packaging Engineer – 2.5D/3D & Chiplet Systems role at Steneg & Partners is now open for applications in Wales, United Kingdom.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).