Senior IC Layout Engineer; .5D/3D
-
Engineering
Engineering Design & Technologists, Manufacturing Engineer, Quality Engineering, Systems Engineer
Job Description & How to Apply Below
Annapurna Labs, within AWS, seeks a Package Layout Design Engineer to advance the physical design of IC packages for next‑gen ML and data center ASICs in Tempe, AZ. You will drive layout from floor planning through tape-out, collaborating with SI/PI, thermal, and manufacturing teams to ensure performance and reliability.
Responsibilities include RDL/substrate routing, die-to-package interface optimization, design rule adherence, and DFM compliance with OSAT partners.
We invite applications for the Senior IC Package Layout Engineer (2.5D/3D) position located in Cupertino, CA, United States.
As a Senior IC Package Layout Engineer (2.5D/3D), you will play an important part at Amazon Inc. in Cupertino, CA, United States.
The following position is for a Senior IC Package Layout Engineer (2.5D/3D) with Amazon Inc.
Our organisation is growing, and we are hiring a Senior IC Package Layout Engineer (2.5D/3D) in Cupertino, CA, United States.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).