Job Description & How to Apply Below
Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimisation of advanced photonic packaging solutions, contributing directly to the development of next‑generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross‑functional environment.
This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team.
Required Skills
Knowledge of semiconductor and photonics packaging concepts
Familiarity with semiconductor assembly processes, including flip‑chip and wire‑bonding manufacturing flows
Experience working in a cleanroom or precision assembly environment
Strong verbal and written communication skills
Master’s degree in physics, Electrical Engineering, Electronics Engineering, or related field
Please contact Rachel Anderson for further details.
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