HBM Platform Architecture Intern: Shape ‑Gen Memory
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Engineering
Test Engineer, Engineering Design & Technologists, CAD/ AutoCAD/ Mechanical Design, Hardware Engineer -
Design & Architecture
Engineering Design & Technologists, CAD/ AutoCAD/ Mechanical Design
Job Description & How to Apply Below
Micron Technology, Inc. seeks an HBM Platform Architecture Intern to analyze electrical, thermal, and power delivery architectures for advanced memory systems.
You will work with experienced architects to evaluate design trade-offs and develop modeling tools that improve performance and efficiency. Responsibilities include signaling analysis, thermal modeling, PDN evaluation, and cross-team collaboration to support future HBM technology development.
We would love to welcome a new HBM Platform Architecture Intern:
Shape Next‑Gen Memory to our organisation in Folsom, CA, United States.
This role is for the HBM Platform Architecture Intern:
Shape Next‑Gen Memory role at Micron Technology, Inc.
We are seeking a motivated HBM Platform Architecture Intern:
Shape Next‑Gen Memory to join Micron Technology, Inc. in Folsom, CA, United States.
Consider building your career as a HBM Platform Architecture Intern:
Shape Next‑Gen Memory at Micron Technology, Inc.
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