Postdoctoral Fellow — Semiconductor Bonding Metrology

The Chronicle Of Higher Education, Inc. is seeking a PREP Research Associate in Gaithersburg, Maryland. This role involves designing and implementing test methods for evaluating chip bonding quality, requiring a PhD in a relevant field. Additional qualifications include experience with wafer bonding processes and proficiency in finite element modeling tools like COMSOL and ANSYS. The salary ranges from $70,000 to $89,000, with attractive total rewards.

This position promises a collaborative environment supporting semiconductor advanced packaging.
We would love to welcome a new Postdoctoral Fellow — Semiconductor Bonding Metrology to our group in Gaithersburg, MD, United States. Step into the Postdoctoral Fellow — Semiconductor Bonding Metrology role at Johns Hopkins University in Gaithersburg, MD, United States and grow with us. Please review the full job details above before applying. If your experience matches this role, we encourage you to apply.