More jobs:
Failure Analysis Engineer; Level
Job in
Kota Batu, Indonesia
Listed on 2025-11-27
Listing for:
Businesslist
Full Time
position Listed on 2025-11-27
Job specializations:
-
Engineering
Quality Engineering, Electronics Engineer
Job Description & How to Apply Below
Location: Kota Batu
Failure Analysis Engineer (Staff Level)
Posting Date : 24 Oct 2025 | Close Date : 22 Jan 2026
Client Background: computer technology company
Tenure:
Permanent
Location:
Batu Kawan, Penang
Headcount: 1
Key Responsibilities- Conduct failure analysis (FA) on assembly products to assess solderability integrity, both on fresh assemblies and after environmental stress testing.
- Define and optimize FA flows and methodologies for different case types to ensure accuracy and efficiency.
- Prepare detailed FA reports
, summarize findings, and assist engineering teams in identifying and resolving defect root causes. - Develop and validate new FA processes, methods, and capabilities to support new product introductions and emerging technologies.
- Plan and execute projects effectively, ensuring timely and cost-efficient delivery of results.
- Maintain the Failure Analysis Laboratory in compliance with internal quality systems and standards.
- Bachelor’s or Master’s Degree in Electrical & Electronic Engineering or Materials Engineering
. - Minimum 5 years of hands‑on experience in Failure Analysis (FA) within the semiconductor, electronics, or related industry.
- Familiarity with IC and passive component structures and defects
.
- Understanding of semiconductor and SMT assembly processes and technologies
. - Knowledge of memory product structure and test methodologies
. - Proven experience preparing technical FA reports and presenting analytical findings.
- Strong communication, teamwork, and problem‑solving abilities.
- Fluent in English (speaking, reading, and technical writing).
- Prior FA experience in IC or memory device analysis is a strong advantage.
- Proficient in the use of FA instruments and techniques
, including:- 3D X‑Ray, Ion Milling, CSAM, SEM/EDX, EBSD, FIB, TEM, TDR, Optical Microscopy, Chemical Decapsulation, and Curve Tracer Analysis.
- Expertise in solder joint and solder microstructure characterization
. - Strong analytical, troubleshooting, and technical documentation skills.
- Ability to apply advanced engineering principles to solve complex technical problems independently.
Sub Specialization:
Engineering;
Others Type of Employment:
Permanent;
Minimum Experience:
5 Years;
Work Location:
Penang
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