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Failure Analysis Engineer; Level

Job in Kota Batu, Indonesia
Listing for: Businesslist
Full Time position
Listed on 2025-11-27
Job specializations:
  • Engineering
    Quality Engineering, Electronics Engineer
Job Description & How to Apply Below
Position: Failure Analysis Engineer (Staff Level)
Location: Kota Batu

Failure Analysis Engineer (Staff Level)

Posting Date : 24 Oct 2025 | Close Date : 22 Jan 2026

Client Background: computer technology company

Tenure:
Permanent

Location:

Batu Kawan, Penang

Headcount: 1

Key Responsibilities
  • Conduct failure analysis (FA) on assembly products to assess solderability integrity, both on fresh assemblies and after environmental stress testing.
  • Define and optimize FA flows and methodologies for different case types to ensure accuracy and efficiency.
  • Prepare detailed FA reports
    , summarize findings, and assist engineering teams in identifying and resolving defect root causes.
  • Develop and validate new FA processes, methods, and capabilities to support new product introductions and emerging technologies.
  • Plan and execute projects effectively, ensuring timely and cost-efficient delivery of results.
  • Maintain the Failure Analysis Laboratory in compliance with internal quality systems and standards.
Qualifications
  • Bachelor’s or Master’s Degree in Electrical & Electronic Engineering or Materials Engineering
    .
  • Minimum 5 years of hands‑on experience in Failure Analysis (FA) within the semiconductor, electronics, or related industry.
  • Familiarity with IC and passive component structures and defects
    .
  • Understanding of semiconductor and SMT assembly processes and technologies
    .
  • Knowledge of memory product structure and test methodologies
    .
  • Proven experience preparing technical FA reports and presenting analytical findings.
  • Strong communication, teamwork, and problem‑solving abilities.
  • Fluent in English (speaking, reading, and technical writing).
  • Prior FA experience in IC or memory device analysis is a strong advantage.
Technical Skills
  • Proficient in the use of FA instruments and techniques
    , including:
    • 3D X‑Ray, Ion Milling, CSAM, SEM/EDX, EBSD, FIB, TEM, TDR, Optical Microscopy, Chemical Decapsulation, and Curve Tracer Analysis.
  • Expertise in solder joint and solder microstructure characterization
    .
  • Strong analytical, troubleshooting, and technical documentation skills.
  • Ability to apply advanced engineering principles to solve complex technical problems independently.

Sub Specialization:
Engineering;
Others Type of Employment:
Permanent;

Minimum Experience:

5 Years;

Work Location:

Penang

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