Position Overview
We are seeking a highly motivated Thermal Engineer to join our Front-End I/O Active Thermal Solutions team. This role is responsible for developing and optimizing active thermal management solutions for high-speed interconnect systems. The ideal candidate will collaborate closely with customers to define boundary conditions, perform thermal simulations, validate designs through lab testing, and deliver optimized, production-ready thermal solutions that meet performance, reliability, and manufacturability requirements.
Key Responsibilities- Customer Collaboration
- Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements.
- Translate customer needs into actionable simulation and test plans.
- Thermal Simulation and Analysis
- Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent).
- Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density front-end I/O environments.
- Perform sensitivity and optimization studies to ensure thermal performance meets design goals.
- Experimental Validation
- Work with lab teams to plan and conduct thermal testing and validation.
- Correlate experimental data with simulation results to refine and validate models.
- Identify and troubleshoot thermal design issues through root-cause analysis and iterative testing.
- Optimization and Reporting
- Optimize designs based on simulation and test results to balance performance, cost, and manufacturability.
- Prepare detailed technical reports summarizing analysis, findings, and recommendations.
- Present results and optimized solutions to customers and cross-functional teams.
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* Education & Experience:
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• Bachelor's or Master's degree in Mechanical Engineering / Thermal Engineering, or a related field.
• 3+ years of experience in thermal design or analysis for electronic systems or interconnect hardware preferred.
** Technical
Skills:
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• Proficiency with CFD tools (ANSYS Icepak, FloTHERM, or equivalent).
• Experience with thermal instrumentation and data acquisition (thermocouples, IR cameras, etc.).
• Familiarity with CAD software (Solid Works, Creo, or similar).
• Strong understanding of heat transfer, fluid dynamics, and electronic packaging.
• Excellent problem-solving and analytical skills.
• Strong communication and presentation abilities for customer interaction and reporting.
• Ability to manage multiple projects in a fast-paced environment.
Preferred Qualifications• Experience developing thermal solutions for high-speed connectors, modules, or front-panel I/O systems.
• Background in active cooling technologies (fans, blowers, heat pipes, vapor chambers, etc.).
• Understanding of electrical and mechanical design trade-offs in system integration.
• Experience with Design of Experiments (DOE) or statistical optimization methods.
Why Work for Us?- Benefits Coverage: Comprehensive health, dental, vision, and travel insurance.
- Health Care Spending Account: Additional financial support for health-related expenses.
- Pension Plan: Company-supported pension scheme.
- Incentive Plans: Progressive employee incentive plans.
- Talent Development: Opportunities for professional growth and development.
- Company Recreation Club: Participate in fun activities, draws with exciting prizes, summer BBQs, holiday parties, and more!
Amphenol Canada is committed to developing inclusive, barrier-free selection processes and work environments. If contacted in relation to a job opportunity, you should advise Amphenol, in a timely fashion, of the accommodation measures which must be taken to enable you to be assessed in a fair and equitable manner. Information received relating to accommodation measures will be addressed confidentially.
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