Principal Packaging Engineer

Principal Packaging Engineer at IC Resources

My client is seeking a Principal Packaging Engineer to lead the design and development of cutting‑edge advanced packaging technologies.

• Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype
• Oversee design, assembly, testing, and validation of advanced packaging demonstrators
• Define technology roadmaps and guide multiple packaging projects
• Collaborate with internal and external teams to solve system‑level integration challenges
• Represent the company in technical forums, proposals, and collaborative bids

• Proven experience in advanced semiconductor packaging – 3D/2.5D
• Strong, extended knowledge of design, modelling, assembly, and validation processes
• Skilled in signal/power integrity and thermal management
• Excellent communication, leadership, and problem‑solving skills
• Track record of delivering demonstrators and leading cross‑functional teams

• Lucrative salary up to mid £70k
• 15% pension (10% employer)
• Annual bonus
• Private medical insurance extended to family
• Visa sponsorship and offer up to £5,000 relocation fees

If you’re looking for a strategic, hands‑on role that defines and delivers next‑generation packaging for AI applications, contact Ella Flynn at IC Resources.

Mid‑Senior level

Full‑time

Engineering and Information Technology

Staffing and Recruiting