Process Engineer

Reporting to the Engineering Manager, the Packaging Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems more energy and packaging efficient.

The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor-based devices, modules and systems.

They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials.

Key responsibilities include:

• Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi-die or system in package (SIP) packaging solutions for power electronics/ RF/ Photonics
• Provide package design inputs, material selection and assembly process development for a number of different semiconductor packages
• Follow the semiconductor/ micro-electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip-Chip, hybrid bonding,
  Wire bond
  , SIP (System in Package)
• R&D of assembly interconnects and interfaces
• Semiconductor package prototyping, testing, reliability & failure analysis
• Develop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issues
• Work with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologies
• Actively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methods
• Study microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packaging
• Gather customer requirements and follow procedures to build assembly process relevant to the project work.
• Conduct experiments to determine material properties and relate these to project work
• Use results from simulations and experiments to aid package design
• Operate key assembly equipment and undertake process and SOP development
• Generate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specifications
• Estimate set-up times, flow-times, costs of production and acceptance equipment
• As needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectives
• Work closely with suppliers providing technical specifications and procuring components and test equipment to specification and budget
• Participate in technical risk assessments