Sr. Principal Electrical Engineer - Analog IC

Sr. Principal Electrical Engineer - Analog IC

Andover, MA or Ottawa, Canada

In this impactful role, you will be responsible for circuit analysis, design, verification, and leading the development of analog integrated circuits used in next‑generation Wi‑Fi front‑end modules in Silicon, SOI, and Bi‑CMOS technologies. Typical circuits include FET and BJT biasing circuits for Tx and Rx, low‑dropout regulators (LDOs), bandgap circuits, linear and logarithmic RF detectors, over‑voltage/over‑current protection, positive and negative charge pumps, op‑amps/OTAs, and closed‑loop feedback circuits for integrated RF modules.

The preferred candidate should also have mixed‑signal and digital integration experience.

To be successful, you should be fully capable of top‑level die development, tape‑out, and product ownership, with a strong knowledge of design flow, layout parasitics, and ESD best practices. You should have demonstrated experience in driving analog design innovation and best practices throughout the product development process, and be comfortable interacting with designers from multiple sites, requiring good communication and presentation skills.

• MS degree (minimum) with at least 12 years of experience in analog IC design using Silicon/SOI/Bi‑CMOS process.
• Strong knowledge in transistor‑level design of standard analog blocks including bandgaps, op‑amps, charge pumps, log detectors, regulators, precision current sources, digital drivers and I/O, basic logic synthesis.
• Experience in top‑level chip integration of analog blocks and understanding of system‑level specifications and requirements.
• Comprehensive simulation skills in Cadence including PEX, device matching, stability analysis, Monte Carlo, and corner analysis.
• Understanding of ESD protection, noise and crosstalk, grounding, design for yield, manufacturability and testability.
• Experience in mixed‑signal and digital integration.
• Experience in analog layout best practices and familiarity with Cadence Virtuoso.
• Understanding of device physics, transistor‑level modeling and general knowledge of IC fabrication in Silicon or CMOS processes 180 nm or below.
• Knowledge of packaging of integrated module IC products and packaging parasitics.
• Strong communication and presentation skills and a desire to be part of a dynamic team.

The typical base pay range for this role across the U.S. is currently USD $143,000 – $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, and work location. Skyworks offers a comprehensive benefits package that includes healthcare benefits (including a premium‑free medical plan option), a 401(k) plan with company match, an employee stock purchase plan, paid time off (vacation, sick/wellness, parental leave), and an incentive plan with potential for additional awards.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at a

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