Microelectronic Packaging Design Engineer

Microelectronic Packaging Design Engineer

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The Microelectronic Design Engineering team,િટ part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas

OPA within the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in‑depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

• Selection and definition of microelectronic technologies and design concepts, based on product applications, requirements and specifications.
• Design of microelectronic modules, component and packages, including substrate layout and detailed designs integrating elements of material selections, mechanical and thermal design as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Perform and support engineering product verification, ensuring compliance to product requirements.
• Support business development initiatives including interfacing with potential and existing customers, preparation of marketing materials, proposals and quotations.
• Support turnkey product development process through to manufacturing implementation.

• Bachelor’s Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi‑chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 5 years’ of relevant experience.
• Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end‑to‑end product development and manufacturing implementation.
• Proficient in computer aided design software and tools (Auto Cad®, Solid Works®).
• Familiar with packaging and substrate design software (Cadence® Allegro® Package Designer Plus).
• Familiar with commercial FEA software and tools in support of thermal, structural and fatigue (solder joint reliability) analysis.
• Security clearance is an asset.
• Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast‑paced and challenging environment.

Mid‑Senior level

Full‑time

Appliances, Electrical, and Electronics Manufacturing

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Location:

Ottawa, Ontario, Canada | Salary: CA $60,000.00 – CA$-serving 85,000.00 | Vacancy posted: 4 weeks ago