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Job Description & How to Apply Below
OUR STORY
Tech Insights is the information Platform for the semiconductor industry.
Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, Tech Insights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.
Over 650 companies and 125,000 users access the Tech Insights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. Tech Insights’ customers include the most successful technology companies who rely on Tech Insights’ analysis to make informed business, design, and product decisions faster and with greater confidence.
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WHY WORK WITH US
Tech Insights is seeking a Technical Product Manager, High Performance Computing (HPC) to define and grow two of our most technically advanced and strategically important product verticals (Advanced Packaging, HPC).
In this role, you will shape the content roadmap that informs the world’s leading semiconductor and system companies about how chips and packages are designed, built, and integrated. You will translate market needs and customer workflow challenges into fact-based syndicated content that connects wafer-level innovation to advanced packaging and system performance.
You will work at the intersection of semiconductor process technology, system design, and business strategy, collaborating with expert analysts, engineering teams, and commercial stakeholders to deliver insights that illuminate how advanced integration and compute architectures are evolving.
This role offers a unique opportunity to make a direct impact on how the semiconductor industry understands innovation in areas such as next-generation HPC processors, high-performance interconnects and packaging, Silicon photonics, and high bandwidth memory (HBM) integration.
WHAT YOU’LL DO
Shape the Product Roadmap
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