Technical Fellow, Advanced Packaging & Performance Computing

Position: Technical Fellow, Advanced Packaging & High Performance Computing

OUR STORY

Tech Insights is the information Platform for the semiconductor industry.

Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, Tech Insights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.

Over 650 companies and 125,000 users access the Tech Insights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. Tech Insights’ customers include the most successful technology companies who rely on Tech Insights’ analysis to make informed business, design, and product decisions faster and with greater confidence.

For more information, visit .

WHY WORK WITH US

• Company-sponsored training and development opportunities
• Comprehensive benefits package (health, dental, vision, wellness, RRSP / 401K Matching, annual fitness reimbursement)
• Flexible vacation policy
• Bring your own device program
• Community involvement opportunities through charitable alliances :
• Wellness resources and support
• Inclusive environment that prioritizes diversity, equity, and accessibility
• High-growth company driven by high performance
• Expected salary range : $175,000 - $195,000 CAD

THE OPPORTUNITY

At Tech Insights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging & High Performance Computing (HPC), you’ll be a central figure in that mission, a recognized technical authority who bridges semiconductor process, advanced packaging, processor architecture, and system-level performance.

This is a rare opportunity to shape the technical direction of two of Tech Insights’ most dynamic product areas:
Advanced Packaging and HPC. You will bring deep expertise in packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.

Your leadership will help define how Tech Insights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.

WHAT YOU’LL DO Lead with Technical Authority

• Serve as Tech Insights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, memory integration, and data center server architectures.
• Provide authoritative insights on leading-edge and emerging technologies, including: 2.5D / 3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives. Co-packaged optics, chip‑to‑chip optical engines, and photonic‑electronic IC integration (PIC + EIC). Hybrid bonded chiplet stacks, SRAM chiplets, and next‑generation thermal and power delivery innovations.

Own and Evolve Technology Roadmaps

• Shape and maintain Tech Insights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
• Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market‑defining innovations.
• Help drive product evolution toward system‑level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.

Accelerate Content Creation through AI and Innovation

• Leverage AI‑enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
• Create and apply new techniques that connect process flow, packaging design, and system performance metrics.
• Assertively drive content velocity and analytical quality across teams.

Engage Globally and Lead by Influence

• Represent Tech Insights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions Tech Insights at the forefront of semiconductor intelligence.
• Mentor…