Senior MEMS & HSIP Packaging Process Engineer
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Draper is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.
You will collaborate with cross-functional teams to develop, optimize, and qualify processes, lead copper electroplating and etch steps, mentor engineers, and drive high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. This role requires a US security clearance and is based in St. Petersburg, FL.
Join us at Draper Labs as our next Senior MEMS & HSIP Packaging Process Engineer in Saint Petersburg, FL, United States.
Our group is growing, and we are hiring a Senior MEMS & HSIP Packaging Process Engineer in Saint Petersburg, FL, United States.
This opportunity is for the Senior MEMS & HSIP Packaging Process Engineer role at Draper Labs.
We are seeking a motivated Senior MEMS & HSIP Packaging Process Engineer to join Draper Labs in Saint Petersburg, FL, United States.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).