Senior Packaging Engineer – Pad Ring & Interconnect
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Engineering
Electronics Engineer, Electrical Engineering, Systems Engineer
Job Description & How to Apply Below
NVIDIA Corporation is seeking an experienced engineer to define and implement chip pad ring and substrate interconnect schemes, leading the package layout design. You will collaborate with circuit, SI, RTL, Place & Route, and system design teams to deliver a robust electrical package.
The role requires a BSEE or equivalent, 8+ years in board/system design (package design preferred), and expertise in transmission line theory and signal integrity.
This Full Time role is for the Senior Packaging Engineer – Pad Ring & Interconnect role at NVIDIA Corporation.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Packaging Engineer – Pad Ring & Interconnect role in the description above.
We appreciate your interest in this position.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).