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Director – Advanced Packaging Technology Development | Micron Technology

Job in Singapore, Singapore
Listing for: NanoHelp
Full Time position
Listed on 2025-10-09
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering, Electronics Engineer
  • IT/Tech
    Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 100000 - 125000 SGD Yearly SGD 100000.00 125000.00 YEAR
Job Description & How to Apply Below

Director – Advanced Packaging Technology Development | Micron Technology, Singapore Lead next-generation packaging innovation in a global semiconductor powerhouse

Micron Singapore seeks a visionary Director to lead its Advanced Packaging Technology Development team. Take charge of high-impact semiconductor innovations, drive process excellence, and shape future memory technologies.

Job Details

  • Title
    :
    Director – Advanced Packaging Technology Development
  • Organization
    :
    Micron Technology, Inc.
  • Work Location
    :
    Singapore
  • Research Field
    :
    Nanotechnology, Electronics, Electrical Engineering, Mechanical Engineering, Applied Physics
  • Funding Info
    :
    Industry-funded (Micron)
  • Final date to receive applications
    :
    Rolling
  • Posted Date
    :
    July 2025
  • Country
    :
    Singapore

Micron Technology is hiring a Director of Advanced Packaging Technology Development (APTD) at its Singapore facility — a senior leadership role pivotal to driving innovation in memory and storage packaging
.

At the heart of Micron’s nanotechnology roadmap
, this role requires a seasoned technologist with the vision to architect and deliver cutting-edge packaging solutions for high-performance products in AI, data centers, and mobile systems.

This opportunity offers more than a job — it offers impact at scale
, with responsibilities that span strategy development, technical execution, and cross-functional leadership.

Key responsibilities include:

  • Define and lead APTD strategies aligned with global innovation goals
  • Guide advanced packaging roadmaps in areas like wafer bonding, plating, and warpage control
  • Collaborate across departments to deliver cost-effective, high-reliability packaging
  • Drive cross-functional efficiency through resource planning, yield optimization, and execution milestones
  • Mentor and grow future leaders while ensuring team capability building and process maturity
  • Champion sustainable and scalable innovation with quality, compliance, and reliability metrics

Requirements

  • PhD, Master’s, or Bachelor’s in Materials Science, Electronics, Mechanical or Applied Physics
  • Track record of solving complex technical challenges and leading large-scale teams
  • Strategic thinker with outstanding communication and cross-functional coordination skills
  • Proven ability to influence corporate direction through technical excellence

Micron is an equal opportunities employer and welcomes applications from all qualified candidates.

Disclaimer
:
Micron does not charge any recruitment fees or request payments from applicants. Candidates must ensure all application details are truthful, including any AI-generated enhancements. Misrepresentation may result in disqualification.

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