Principal Engineer, Quality - Bandwidth Memory
Listed on 2025-10-23
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Engineering
Electrical Engineering, Quality Engineering, Systems Engineer
Principal Engineer, Quality - High Bandwidth Memory
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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities.
As a Principal Product Quality and Reliability Assurance Engineer (PQRA), you will support reliability qualification and quality monitoring of High Bandwidth Memory products (HBM), help develop product reliability methodologies, and respond to product deviations as they pertain to quality and reliability. You will establish and implement requirements, specifications, and metrics such as Defects per Million (DPM), Failure in Time (FIT), and Lifetime.
In this role, you will work with multi‑functional engineering teams to ensure product reliability methods are established and followed, perform risk assessments, and provide support for manufacturing teams regarding reliability issues.
- Define High Bandwidth Memory (HBM) qualification requirements
- Comprehend failures and failure rate within the scope of the qualification
- Perform risk assessment at all decision points within the qualification cycle
- Review qualification data and sign off that qualification requirements have been met
- Issue internal product release notifications for qualification
- Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams
- Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues
- Develop and improve product reliability tests to assess new HBM failure mechanisms
- Coordinate and drive vital specification improvements for existing products
- Review internal quality metric and drive customer DPM to BIC
- Establish and review ongoing product Quality Metrics
- Assess deviations for product quality and reliability risks
- Data mining and correlation of all inline test data. Root cause finding and drive CA/PA
- Define evaluation necessary to mitigate risks
- Review and support process Excursion Analysis
- Communicate violations to defined release/acceptance criteria
- Communicate issues and corrective actions across all Micron products
- Assist RMA Team with detailed analysis of returned material
- Investigate manufacturing history and identify issues related to customer failure signature
- Perform additional data collection as needed and per customer request
- Develop Reliability Process Monitor (RPM) plans
- Assist with necessary corrective actions at the manufacturing level
- Comprehend field failure rates relative to internal failure rates
- Guide a team of engineers through the full product qualification lifecycle, ensuring technical excellence and timely delivery
- Deliver impactful presentations and lead strategic discussions with senior leadership to align on goals, progress, and outcomes
- Mentor new team members, foster a culture of collaboration and continuous learning, and build a high‑performing, resilient engineering team
- BS or MS in Electrical engineering or related field of study
- 8+ years of experience in semiconductor field
- Knowledge of DRAM operation, fabrication process and semiconductor device physics
- Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow
- Strong troubleshooting skills
- Good organizational skills and sharp attention to detail
- Good written and oral communication skills
- Ability to work independently or in a group environment
- Knowledge of using statistical tools like JMP, familiarity with Unix, DFII/Cadence, and/or…
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