Hardware Developer

Introduction Your role and responsibilities

Hardware Developer, IBM Corporation, Albany, NY (Up to 20% telecommuting permitted):

• Develop Reactive Ion Etch (RIE) solutions to support internal systems, products, and partner/customer development needs.
• Collaborate with lithography, metrology, integration, and unit process engineers to deliver functional modules for advanced technology demonstration.
• Communicate with equipment vendors to identify and request necessary improvements for enabling new technologies.
• Optimize processes by evaluating different options and recommending the most effective solutions.
• Design and perform cleanroom experiments to improve the patterning process.
• Analyze tool, metrology, inspection, and electrical data to assess process performance and provide technical feedback.
• Improve process repeatability and manufacturing viability, focusing on throughput and material consumption.
• Advance processes from the design and concept stages to manufacturing readiness.
• Work independently within a matrix team environment to meet project goals efficiently.
• Manage resources in a semiconductor fabrication (fab) facility using wafer processing systems like SiView.
• Develop and document intellectual property and publish findings related to semiconductor product development.
• Utilize:
  Semiconductor Fabrication Techniques, Reactive Ion Etch, Optical Emission Spectroscopy (OES), Design of Experiments (DOE) and Root Cause Analysis (RCA), CD SEM and TEM Data Analysis, Statistical Process Control (SPC), Fault Detection and Classification (FDC).

Required:

Bachelor’s degree or equivalent in Physics, Chemistry, Engineering or related and two (2) years of experience as a Process Engineer or related. Two (2) years of experience must include utilizing Semiconductor Fabrication Techniques, Reactive Ion Etch, Optical Emission Spectroscopy (OES), Design of Experiments (DOE) and Root Cause Analysis (RCA), CD SEM and TEM Data Analysis, Statistical Process Control (SPC), Fault Detection and Classification (FDC).

$155149 to $205000 per year. Full time. AV211.

Bachelor’s degree or equivalent in Physics, Chemistry, Engineering or related and two (2) years of experience as a Process Engineer or related. Two (2) years of experience must include utilizing Semiconductor Fabrication Techniques, Reactive Ion Etch, Optical Emission Spectroscopy (OES), Design of Experiments (DOE) and Root Cause Analysis (RCA), CD SEM and TEM Data Analysis, Statistical Process Control (SPC), Fault Detection and Classification (FDC).

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.