Process Integrator Advanced Packaging & Co-Packaged Optics R&D

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology.

Salary: $ - $

Location:

Albany,NY, Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

We are seeking an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment. This role will connect unit processes, materials, device requirements, metrology, reliability, and equipment capabilities into robust integrated flows. The successful candidate will work across Applied Materials business units, external partners, and customers to convert complex technical objectives into executable integration plans, learning cycles, and differentiated solutions.

Experience in co-packaged optics (CPO), photonics packaging, or optical/electrical heterogeneous integration is strongly preferred.

• Own end-to-end process integration for advanced packaging and heterogeneous integration programs, from initial concept and architecture through demonstration and technology transfer.
• Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces, including module sequences, process windows, control plans, and learning-cycle strategies.
• Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into process-integration specifications and measurable success criteria for CPO modules.
• Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling, and reliability teams.
• Drive integration of photonic and electronic die, including die-to-wafer or wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach interfaces, and advanced substrate or interposer integration.
• Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, alignment tolerance, interconnect performance, thermal behavior, defectivity, yield, and reliability.
• Integrate laser, modulator, detector, waveguide, electronic IC, thermal-management, and package-level requirements into stable module and full-flow performance.
• Identify and resolve CPO integration risks such as contamination, bonding defects, overlay and alignment error, warpage, thermal-mechanical stress, optical-interface degradation, and process-induced device shifts.
• Create CPO technology roadmaps, integration reviews, risk assessments, schedules, and executive-ready reports; communicate clearly with…