EMIB-T Substrate Yield Engineer

Job Description:

Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, technical issue closure, and process‑control maturity supporting next generation EMIB‑T substrates across Japan suppliers. The team will be chartered to lead yield performance for next‑generation advanced packaging technologies, including EMIB‑T (Embedded Multi‑die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration partnering with substrate suppliers locally at the HVM factories.

This is a high‑visibility, high‑accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG).
The ideal candidate is a self‑starter who thrives in ambiguous and fast‑paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross‑functional teams and suppliers, and a relentless focus on delivering yield and program milestones.

• Own day‑to‑day yield performance and issue closure for assigned supplier lines, modules, products, or process areas.
• Lead structured investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
• Use statistical and spatial analytics to identify signatures by line, tool, material, panel position, geometry, product, and time.
• Establish clear supplier actions, owners, completion criteria, control limits, and verification plans.
• Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
• Capture reusable learning and communicate facts, hypotheses, decisions, and residual risks clearly.

• Strong analytical and problem‑solving skills with the ability to make data‑driven decisions in complex environments.
• Experience working across multiple organizations and influencing stakeholders to achieve results.
• Demonstrated ability to independently manage complex technical issues, execute with urgency, and drive actions to closure.

• Bachelor's degree with +8 years of experience in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline, OR Master's degree with 6+years, OR PhD with 4+years.
• 5+ years of experience in:
  • Semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
  • Hands‑on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
  • Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML‑based defect detection, or automated defect classification systems.

• Experience working directly with substrate suppliers and external manufacturing partners.
• Demonstrated program leadership experience, including coordinating cross‑functional technical teams and driving execution in high‑visibility, high‑impact environments.
• Experience with semi‑additive processing, build‑up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration.
• Prior experience supporting technology development, qualification,…