Senior Tech Leader, Advanced Packaging & Deposition
Listed on 2026-10-13
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Engineering
Packaging Engineer, Materials Engineering, Quality Engineering, Manufacturing Engineer
Intel Corporation is seeking a Senior Technical Leader for its Advanced Packaging group in Albuquerque, NM. You will drive process innovation across CVD, ALD, and PVD thin-film deposition, enabling high-volume manufacturing for EMIB, Foveros, and Silicon Photonics technologies.
You will lead cross-functional efforts with Technology Development, HVM, Product Engineering, and Supply Chain to deliver manufacturable, high-yield solutions while meeting cost and customer requirements.
This is a strong role to take on the Senior Tech Leader, Advanced Packaging & Deposition role at Intel Corporation.
Consider building your career as a Senior Tech Leader, Advanced Packaging & Deposition at Intel Corporation.
The Senior Tech Leader, Advanced Packaging & Deposition position in the Engineering, Other field is open for applications.
We have an opening for a Senior Tech Leader, Advanced Packaging & Deposition in Albuquerque, NM, United States within Engineering, Other.
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