RF PCBA Design and Test Engineer

Worker Type Regular Job Description Summary We are seeking an RF PCBA Design and Test Engineer for the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products.

You will own the PCB lifecycle—from stack-up definition and layout governance through fabrication, assembly, bring‑up, release, and test lifecycle for production circuit card assemblies (CCAs) and integrated RF systems.

• Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets.
• Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders).
• Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity).
• Perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance.
• Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor.
• Run formal design reviews, drive closure of action items, and maintain design histories, BOMs, and ECOs through PLM.
• Own fab and assembly drawing packages, stack-up notes, controlled impedance requirements, coupons, panelization, and testability features.
• Collaborate with PCB fabs/CMs on builds (Class3), negotiate tolerances, and resolve issues (mask alignment, plating thickness, impedance yield, lamination strategy).
• Plan and execute board bring‑up; define acceptance tests and interface with RF test for S‑parameters, noise figure, PAE, ACPR/EVM, and linearity (P1dB/IP3/AM‑AM/AM‑PM).
• Define, implement, and sustain acceptance tests for CCAs (Rx/Tx/control/power) with clear entry/exit criteria, coverage metrics, and pass/fail limits; maintain golden units and calibration artifacts.
• Architect automated test sequences (Python/LabVIEW/MATLAB or similar) for VNAs, spectrum analyzers, signal generators, power meters, oscilloscopes, and RF switch matrices; integrate data logging, serialization, and dashboards; manage version control and CI where appropriate.

Other duties as assigned

• Bachelor’s degree in electrical engineering or related engineering field.
• 8+ years in RF/microwave and mixed-signal PCB development for high-reliability products.
• Proven expertise in RF board layout for L/S/C/X/Ku/Ka‑band front‑ends (LNAs, PAs, switches, beamformers, PLL/synth, couplers/splitters).
• Hands‑on with hybrid stack‑ups, controlled impedance design, backdrill/HDI strategies, and thermal/shielding practices.
• Proficiency with one or more ECAD suites (Altium Designer, Cadence Allegro/OrCAD, Mentor/Xpedition) and analysis tools (Keysight ADS, Ansys HFSS/SIwave, CST).
• Hands‑on with RF measurements and analysis: S‑parameters, gain/NF, linearity (P1dB/IP3), modulation metrics (EVM/ACLR), phase noise, timing/synchronization, PLL/synth chains, PA/LNA/mixer characterization.
• Proficiency automating instruments and data pipelines (Python and/or LabVIEW; MATLAB a plus) using SCPI/IVI; experience with LAN/USB/GPIB control, data historians/MES, and dashboarding (e.g., Power BI/Tableau/SQL).
• Working knowledge of IPC‑2221/2223, IPC‑6012, IPC‑A‑600/-610 Class3, ANSI/ESD S20.20, environmental/EMI test practices (e.g., MIL‑STD‑810/461 as applicable), calibration traceability,+ and DoD documentation practices.
• Ability to…