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Ecosystem Integration Engineer

Job in 1013 ML, Amsterdam, North Holland, Netherlands
Listing for: Axelera AI
Full Time position
Listed on 2026-06-13
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Electrical Engineering, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 EUR Yearly EUR 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Position Overview
Axelera AI is building the world’s most efficient AI inference silicon. As we scale deployments of our Metis and Europa-based platforms through ODM, OEM, and CM partnerships in the Asia-Pacific region, we need a technically strong Integration Engineer embedded in Taiwan.

This role is the primary technical interface between Axelera’s AI Integrated Systems (AIS) engineering team and our external partners in Taiwan — covering ODM system integrators, contract manufacturers during NPI/production ramp, and component suppliers. You will ensure that Axelera hardware integrates correctly into partner platforms, that production quality issues are resolved rapidly, and that partners can successfully deploy a complete solution.

Key Responsibilities
ODM / OEM System Integration Support

Act as the primary technical point of contact for ODM partners adopting Axelera PCIe accelerator cards, M.2 modules, and AI SBCs into their systems.

Guide partners through hardware integration: compatibility, power budget, cooling, mechanical clearances, and BIOS/firmware settings.

Support partner bring‑up: OS/driver installation, Voyager SDK deployment, and first‑inference validation on customer platforms.

Produce and maintain integration guides, application notes, and FAQs tailored to key ODM accounts.

Contract Manufacturer (CM) NPI & Production Support

Provide on‑site or remote support to CMs during Mass Production Introduction (MPI) phases, including first‑article inspection and pilot‑run reviews.

Review and validate CM production test procedures against Axelera ATE/ICT requirements; escalation to the AIS engineering team as needed.

Own in‑field production defect triage: collect failure evidence, replicate issues on bench, and drive root‑cause analysis with R&D engineers.

Maintain a defect log and track corrective/preventive actions (CAPA) through to closure.

Supplier Technical Interface

Coordinate with power component suppliers (DCDC converters, PMUs, DDR, passive components) on qualification questions and field‑reported anomalies.

Perform bench characterisation of power‑related issues (efficiency, regulation, transient response) and communicate findings to internal power integrity engineers.

Support BOM change evaluations for sourced alternatives, providing electrical equivalency data to the AIS team.

Component & Design Qualification

Contribute to the qualification of new components (power ICs, passives, memory, connectors) for Axelera in‑house hardware products.

Evaluate pin‑compatible or functionally equivalent alternatives proposed during BOM reviews or component end‑of‑life transitions; provide electrical characterisation data and board‑level validation results to the AIS design team.

Support design verification activities for new PCB revisions or new product introductions: perform bring‑up, functional testing, and regression against previous hardware baselines.

Act as the local technical interface with design partners or EMS providers during engineering prototype builds (EVT/DVT), collecting build feedback and coordinating issue resolution with Axelera HW engineers.

Document qualification outcomes, test reports, and design deviation assessments in Axelera’s PLM/document control system.

Qualifications
Essential

5+ years of hands‑on experience in electronic hardware engineering, with a focus on embedded or system‑level PCB design.

Solid understanding of digital interfaces: PCIe, USB, I2C/SPI/UART, LPDDR — at both schematic and signal‑integrity level.

Proficiency with lab instruments: oscilloscope, logic analyser, power analyser, JTAG debugger.

Ability to read and annotate schematics and PCB layouts.

Proven experience integrating add‑in cards or modules (PCIe, M.2, MXM, or similar) into OEM/ODM host platforms.

Familiarity with mechanical and thermal constraints: heatsink mounting, TIM selection, chassis airflow, and IEC/JEDEC temperature classifications.

Understanding of EMC/ESD considerations at board and system level.

Comfortable installing and configuring Linux (Ubuntu/Debian) from scratch, including kernel module loading and device tree basics.

Ability to follow SDK documentation, execute inference pipelines, and…
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