Senior Substrate Layout Engineer – Multi‑Die Packaging
Listed on 2026-10-30
-
Engineering
Packaging Engineer, Quality Engineering
Piper Companies is seeking a Substrate Layout Engineer to join a rapidly growing AI infrastructure and semiconductor technology organization. The Substrate Layout Engineer will support the physical layout and routing of organic substrates, interposers, and package technologies for next‑generation multi‑die compute products designed for high‑performance AI and data center applications.
This onsite role in Sarasota requires 8+ years of hands‑on experience, proficiency with Siemens Xpedition or
Join us at Piper Companies as our next Senior Substrate Layout Engineer – Multi‑Die Packaging in CA, United States.
For the Senior Substrate Layout Engineer – Multi‑Die Packaging position at Piper Companies, we are reviewing applications now.
Step into the Senior Substrate Layout Engineer – Multi‑Die Packaging role at Piper Companies in CA, United States and grow with us.
Please review the full job details above before applying.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).