Senior Packaging Engineer: Chip Pads & Interconnect
Listed on 2026-10-30
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Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer, Electrical Engineering
NVIDIA Corporation in California seeks an experienced packaging/design engineer to define and implement chip pad rings, substrate interconnect schemes, and lead the package layout design process.
Collaborate with circuits, signal integrity, RTL, place-and-route, substrate layout and system design teams to deliver a robust electrical packaging solution. Requires a BSEE or equivalent and 8+ years in board/system design, with package design experience preferred.
Are you ready to take on the Senior Packaging Engineer:
Chip Pads & Interconnect role at NVIDIA Corporation?
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Chip Pads & Interconnect at NVIDIA Corporation, could be your next career step.
We would love to welcome a new Senior Packaging Engineer:
Chip Pads & Interconnect to our group in CA, United States.
For the Senior Packaging Engineer:
Chip Pads & Interconnect position at NVIDIA Corporation, we are reviewing applications now.
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