Microelectronics Integration Engineer

Date Posted:  Country:
United States of America

Location:

US-MA-ANDOVER-AR2 ~ 362 Lowell St ~ AR2 PLYMOUTH BLDG Position Role Type:
Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract. Security Clearance Type:
DoD Clearance:
Secret Security Clearance Status:
Active and existing security clearance required after day 1

As a member of the RF Microelectronics (RFMicro) Department, the individual will provide process and manufacturing engineering support for Raytheon’s microelectronics foundry in Andover, MA. The Microelectronics Integration Engineer is responsible for all aspects of manufacturing execution required to fabricate and deliver compound semiconductor wafers to internal, DoD, and external customers. The role will focus on one or more of our production-released GaN HEMT process technologies.

The ideal candidate will have a broad understanding of semiconductor tools, processing techniques, microelectronic circuit testing, and circuit design, with expertise in one or more of these areas. They will identify opportunities and lead initiatives to improve process yields and reduce performance variation of integrated circuits. The ability to perform hands-on investigative work in small, cross-functional teams is essential.

• Participate in failure investigation teams addressing scrap, product performance issues, or yield excursions
• Support teams in improving all aspects of process technology health (performance, reliability, variation, unit cost, cycle time, capacity/throughput)
• Manage in-line electrical data trends and process control metrics
• Maintain technical documentation (recipes, out-of-control action plans, FMEAs)
• Collaborate with operations, quality, and engineering staff in dynamic team environments
• Manage evolving projects and priorities based on production needs, customer commitments, or direction from project leads

• Typically requires a Bachelor’s Degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience (or an advanced degree with 2 years of industry experience)
• Experience with semiconductor processing tools and techniques, including photolithography, wet and dry etching, metal evaporation, metrology tools, and/or automated inspection systems
• The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

• Expertise in the fabrication and characterization of Gallium Nitride HEMT devices
• Experience in characterizing, understanding, and improving semiconductor device quality and reliability
• Excellent communication skills with the ability to convey technical ideas and data effectively
• Ability to lead and coordinate technical projects involving cross-functional teams
• Basic understanding of semiconductor device structures and their electrical characteristics
• Basic understanding of Manufacturing Execution Systems
• Proficiency in statistical process control and lean manufacturing methods

Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value:
Trust, Respect, Accountability, Collaboration, and Innovation. As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote.

The salary range for this role is 86,800 USD - 165,200 USD. The salary range…