Sr Principal Semiconductor Electroplating Process Engineer

RELOCATION ASSISTANCE:
Relocation assistance may be available

CLEARANCE TYPE:
Secret

TRAVEL:
Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking an experienced and motivated Senior Principal Microelectronics Semiconductor Electroplating Process Engineer for our Advanced Packaging Technology facility in Apopka, Florida.

For more than 70 years, Northrop Grumman’s Microelectronics Center has pushed the boundaries in this ever-evolving field of microelectronics. Our two U.S.

-based government-trusted foundries and state-of-the-art packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Senior Principal Microelectronic Semiconductor Electroplating Process Engineer will provide senior fabrication support and technical direction for a wide range of electroplating processes and tools for semiconductor wafers. The selected candidate will own the responsibility for process technology development and production deployment for multiple plated metal interconnect processes, including underbump metallurgy, copper pillars, and solder bumps fabricated across multiple equipment systems.

They will collaborate closely with other process owners for back-end post-processing to ensure satisfactory integration of plating processes into overall product flows for both production parts, as well as new process and product development activities.

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team.

Position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.

Responsibilities include, but are not limited to, the tasks outlined below:

Leadership and collaboration :

Primary electroplating team leader responsible for all wafer electroplating manufacturing processes, development, and associated metrology. Role will require experience with production deployment across a broad range of tool sets, processes, and wafer sizes.

Work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, and drive continuous improvement initiatives.

Mentor and train junior engineers and technicians on shift to support quality and delivery metrics for operations.

Effectively communicate with the team with a strong attention to detail.

Process/ Equipment Management :

Oversee and develop robust, manufacturable process recipes for Foundry customers in metals electroplating (e.g., copper, nickel, SnAg, Au) and associated metrology and analysis using designs of experiments (DOEs) and industry standard methods.

Identify, resolve issues, and improve these plating processes to provide maximum quality and process availability.

Ensure all plating equipment is properly qualified and calibrated.

Process Development:

Define and implement electroplating process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, and cost.

Develop new technologies across the portfolio of…