Principal Engineer Microelectronic Semiconductors Security Clearance

Position: Principal Engineer Microelectronic Semiconductors with Security Clearance
RELOCATION ASSISTANCE:
Relocation assistance may be available CLEARANCE TYPE:
Interim Secret TRAVEL:
Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is looking for you to join our team as a Principal Microelectronics Semiconductor Metals Process Engineer for our Advanced Packaging Technology facility in Apopka, FL. The Principal Microelectronic Semiconductor Metals Process Engineer will provide senior fabrication support and technical direction for a wide range of metals processes and tools for semiconductor wafers. The selected candidate will own the responsibility for process technology development and production deployment for multiple metal interconnect processes, including PVD and solder bumps fabricated across multiple equipment systems.

They will collaborate closely with other process owners for back-end post-processing to ensure satisfactory integration of under bump metallization and sphere drop processes into overall product flows for both production parts, as well as new process and product development activities. The chosen candidate must have excellent verbal and written communication skills; be able to multitask in a fast-paced, dynamic, and high-visibility environment;

and work well as part of a team. The position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required. What You'll get to Do :
Team:
* Primary metals team leader responsible for all PVD and plasma clean processes, development, and associated metrology. The role will require experience with production deployment across a broad range of tool sets, processes, and wafer sizes.
* Work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, high-volume ramp, and drive continuous improvement initiatives.
* Mentor and train junior engineers and technicians on shift to support quality and delivery metrics for operations.
* Drive process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, and cost.
* Excellent oral and written communication skills with a strong attention to detail.
* The ability to lead and work efficiently in a group or as an individual contributor.
* Demonstrated ability to lead complex multi-tool process development projects
* Fluency in MS Office software applications Process/ Equipment Management:
* Oversee and develop robust, manufacturable process recipes for Foundry customers in PVD, plasma cleaning, and bumping processes, and the associated metrology and analysis using designs of experiments (DOEs) and industry standard methods.
* Identify, resolve issues, and improve these plating processes to provide maximum quality and process availability.
* Ensure all metal equipment is properly qualified and calibrated. Process Development:
* Define and optimize PVD thin films, plasma cleans, dry etching(metal etch), sphere drop, and redistribution layers for bumping processes in support of new technologies.
* Develop new technologies across the portfolio of emerging technologies in semiconductor wafer-level interconnect manufacturing on multiple wafer sizes. Quality Control:
* Execute strategic projects for improvement of sustaining operations through monitoring statistical process…