Senior or Principal Product Manager, Texas Institute Electronics

Senior or Principal Product Manager, Texas Institute for Electronics

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Job Posting

Title:

Senior or Principal Product Manager, Texas Institute for Electronics

Hiring Department: Texas Institute for Electronics

Position Open To: All Applicants

Weekly Scheduled

Hours:

40

FLSA Status: To Be Determined at Offer

Earliest

Start Date:

Ongoing

Position Duration: Expected to Continue

Location: AUSTIN, TX

Job Details:

The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. You will bridge technical teams and customer requirements to facilitate cross-functional collaboration and strategic partnerships that enhance product success and industry presence.

• Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives.
• Author and maintain comprehensive Product Requirements Documents (PRDs) guiding process development, EDA integration, and packaging engineering teams to ensure aligned, efficient development efforts.
• Drive cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure cohesive features and releases.
• Engage with customers and industry partners to align capabilities with evolving industry needs; represent TIE in technical discussions and customer design reviews.
• Serve as a technical champion for 2.5D/3D integration and guide internal decision-making; address real-world challenges in chiplet-based system design.
• Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive platform milestones.
• Create technical documentation and collateral (integration guidelines, reference designs, user guides) to support customer design teams and enable rapid adoption.
• Monitor advanced packaging market trends and competitive developments; inform product positioning and feature prioritization.
• Promote a culture of accountability and transparency across product work streams; keep stakeholders informed and commitments met.
• Other related functions as assigned.

• Education:
  
  BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development.
• Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development.
• Technical Expertise:
  Experience in advanced packaging technologies (e.g., 2.5D interposers, TSVs, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration; understanding of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
• Process & EDA Familiarity:
  Working knowledge of semiconductor fabrication processes and EDA flows for PDK/ADK creation and integration with major EDA vendor flows.
• Exceptional communication skills; ability to translate between engineering and market/customer contexts.
• Startup DNA:
  Comfortable in ambiguity, acts with urgency, and takes ownership in a fast-paced environment.
• Execution mindset:
  Experience driving progress across multiple initiatives in a hands-on role.
• Location:
  
  Austin, Texas is preferred; hybrid work arrangements may be possible with travel up to 30–50% as needed, subject to policy.
• Relevant education and experience may be substituted as appropriate.

• Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or related field.
• Program Leadership:
  End-to-end ownership of complex programs with multiple stakeholders; knowledge of success metrics and interdependencies.
• Vendor/Partner Management:
  Experience…