Metrology Development Engineer II or Senior Metrology Development Engineer, Texas Institute
Listed on 2025-12-17
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Engineering
Electronics Engineer, Electrical Engineering, Process Engineer, Materials Engineer
Metrology Development Engineer II or Senior Metrology Development Engineer, Texas Institute for Electronics
Join the Texas Institute for Electronics (TIE) to help push the boundaries of critical semiconductor domains, including advanced packaging, and contribute to the development of state‑of‑the‑art 3D heterogenous integration manufacturing technologies.
Hiring Department
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Texas Institute for Electronics Position Open To
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All Applicants Weekly Scheduled Hours
: 40 FLSA Status
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To Be Determined at Offer Earliest Start Date
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Ongoing Position Duration
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Expected to Continue Location
: PICKLE RESEARCH CAMPUS
The Texas Institute for Electronics (TIE) is a University of Texas at Austin‑supported semiconductor consortium of state and local government, leading defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. With over $1 billion in funding from the U.S. DoD and the state of Texas, TIE creates cutting‑edge semiconductor manufacturing equipment and processes that set the course for future advancements in logic, memory, heterogeneous integration, chip cooling and more.
Situated in Austin, TIE embodies the city’s innovative spirit.
- Lead the selection, procurement, installation and qualification of metrology equipment and systems.
- Develop a TIE‑specific metrology tool set that effectively measures electrical, thermal, and mechanical performance metrics for 3
DHI systems. - Support TIE by providing accurate and actionable measurement data to sister groups working on process development.
- Provide vision and direction in developing forward‑looking measurement technologies and establish a robust metrology roadmap.
- Drive corrective actions as part of cross‑functional teams to identify systemic yield and reliability issues, including failure analysis to troubleshoot/root‑cause.
- Participate in the hiring process for technicians and junior engineers.
- Other related functions as assigned.
- Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or other relevant discipline.
- Minimum 5 years of experience working in Mechanical R&D roles with prior experience in metrology labs and the semiconductor industry.
- Strong knowledge of thermal and mechanical metrologies from theory through practical application of novel measurement methods.
- Mission‑oriented approach with ability to manage multiple projects simultaneously.
- Excellent written and verbal communication skills.
- Demonstrated ability to work successfully in a collaborative team environment.
- Experience writing and working with project‑level requirements and specifications.
- Excellent analytical and problem‑solving skills, and attention to detail.
- Experience in a startup or research and development (R&D) environment.
- Prior experience in semiconductor design, characterization, and/or process integration.
- Solid understanding of semiconductor packaging technologies, including wire bonding, flip‑chip, wafer‑level packaging, and 3
DHI. - Prior experience in software development for hardware control and instrumentation.
- Experience leading teams, working with contractors and managing people.
$100,000+ depending on qualifications
Working Conditions- May work around standard office conditions.
- Repetitive use of a keyboard at a workstation.
- Use of manual dexterity (e.g., mouse).
- Workspace is on‑site in a scientific research environment and prototyping facility with dynamic conditions and collaboration with many partners and customers.
- Work outside standard office hours may be required occasionally during peak periods and special events.
- Resume/CV
- Three work references with contact information (at least one supervisor reference)
- Letter of interest
Applicants who are not current university employees or contingent workers: you will be prompted to submit your resume the first time you apply, then you may upload additional materials such as a letter of interest or references in the Application Questions section. Once submitted, the application cannot be changed.
Current university…
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